LiPOLY之EP770-s是可以在室溫或高溫下固化非矽型雙劑導熱灌封膠，灌封膠是液體流動性導熱膠，可填滿電子器件周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運行進行熱傳導，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。
何謂低分子矽氧烷?
化學式表示沒有反應性的環狀聚二甲基矽氧烷Ho-[Si(CH3)2O]n-H 具有揮發性隨時揮發散逸，如電子產品又於密閉空間時，此時低分子矽氧烷，便會造成電器接點障礙。
Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.
